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Recent
Nanver, L. K., Liu, X., & Knežević, T. (2018). Test structures without metal contacts for DC measurement of 2D-materials deposited on silicon. In 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) (pp. 69-74). (IEEE International Conference on Microelectronic Test Structures (ICMTS)). Piscataway, NJ: IEEE. DOI: 10.1109/ICMTS.2018.8383767
Nanver, L. K., Lyon, K., Liu, X., Italiano, J., & Huffman, J. (2018). Material Reliability of Low-Temperature Boron Deposition for PureB Silicon Photodiode Fabrication. MRS Advances. DOI: 10.1557/adv.2018.506
Liu, X., Nanver, L. K., & Scholtes, T. L. M. (2017). Nanometer-Thin Pure Boron Layers as Mask for Silicon Micromachining. Journal of microelectromechanical systems, 26(6), 1428-1434 . DOI: 10.1109/JMEMS.2017.2764322
Liu, X., & Nanver, L. K. (2016). Comparing current flows in ultrashallow pn-/Schottky-like diodes with 2-diode test method. In Microelectronic Test Structures (ICMTS), 2016 International Conference on (pp. 190-195). New York: IEEE. DOI: 10.1109/ICMTS.2016.7476205
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Universiteit Twente
Faculteit Elektrotechniek, Wiskunde en Informatica
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Universiteit Twente
Faculteit Elektrotechniek, Wiskunde en Informatica
Carré
C2732
Postbus 217
7500 AE Enschede