Publicaties
Recent
Nanver, L. K., Knezevic, T.
, Liu, X.
, D. Thammaiah, S.
, & Krakers, M. (2021).
On the Many Applications of Nanometer-Thin Pure Boron Layers in IC and Microelectromechanical Systems Technology.
Journal of nanoscience and nanotechnology,
21(4), 2472-2482.
https://doi.org/10.1166/jnn.2021.19112
Liu, X. (2021).
Low temperature pure boron layer deposition for silicon diode and micromachining applications. [PhD Thesis - Research UT, graduation UT, University of Twente]. University of Twente.
https://doi.org/10.3990/1.9789036552547
Nanver, L. K., Qi, L.
, Liu, X., & Knežević, T. (2021).
Nanolayer boron-semiconductor interfaces and their device applications.
Solid-state electronics,
186, [108041].
https://doi.org/10.1016/j.sse.2021.108041
Thammaiah, S. D.
, Liu, X., Knežević, T.
, Batenburg, K. M.
, Aarnink, A. A. I.
, & Nanver, L. K. (2021).
PureB diode fabrication using physical or chemical vapor deposition methods for increased back-end-of-line accessibility.
Solid-state electronics,
177, [107938].
https://doi.org/10.1016/j.sse.2020.107938
Apaydin, R. O.
, Onnink, A. J.
, Liu, X.
, Aarnink, A. A. I.
, de Jong, M. P.
, Gravesteijn, D. J.
, & Kovalgin, A. Y. (2020).
Comparative study of thermal and radical-enhanced methods for growing boron nitride films from diborane and ammonia.
Journal of vacuum science and technology A: vacuum, surfaces, and films,
38(3), [033411].
https://doi.org/10.1116/6.0000132
Krakers, M., Knezevic, T.
, Batenburg, K. M.
, Liu, X.
, & Nanver, L. K. (2020).
Diode design for studying material defect distributions with avalanche-mode light emission. In
2020 IEEE 33rd International Conference on Microelectronic Test Structures, ICMTS 2020 - Proceedings [9107933] (IEEE International Conference on Microelectronic Test Structures; Vol. 2020). IEEE.
https://doi.org/10.1109/ICMTS48187.2020.9107933
Knežević, T., Suligoj, T.
, Liu, X.
, Nanver, L. K., Elsayed, A., Dick, J. F., & Schulze, J. (2019).
Back-end-of-line CMOS-compatible diode fabrication with pure boron deposition down to 50 °C. In
ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (pp. 242-245). [8901810] (European Solid-State Device Research Conference; Vol. 2019-September). IEEE.
https://doi.org/10.1109/ESSDERC.2019.8901810
Liu, X., Italiano, J., Scott, R.
, & Nanver, L. K. (2019).
Silicon micromachining with nanometer-thin boron masking and membrane material.
Materials Research Express,
6(11), [116438].
https://doi.org/10.1088/2053-1591/ab4b03
Knezevic, T.
, Liu, X.
, Hardeveld, E., Suligoj, T.
, & Nanver, L. K. (2019).
Limits on Thinning of Boron Layers With/Without Metal Contacting in PureB Si (Photo)Diodes.
IEEE electron device letters,
40(6), 858-861. [8686173].
https://doi.org/10.1109/LED.2019.2910465
Nanver, L. K.
, Liu, X., & Knezevic, T. (2018).
Test structures without metal contacts for DC measurement of 2D-materials deposited on silicon. In
ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures (pp. 69-74). (IEEE International Conference on Microelectronic Test Structures; Vol. 2018-March). IEEE.
https://doi.org/10.1109/ICMTS.2018.8383767
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