X. Liu (Xingyu)

Nanver, L. K., Knezevic, T. , Liu, X. , D. Thammaiah, S. , & Krakers, M. (2021). On the Many Applications of Nanometer-Thin Pure Boron Layers in IC and Microelectromechanical Systems Technology. Journal of nanoscience and nanotechnology, 21(4), 2472-2482. https://doi.org/10.1166/jnn.2021.19112

Liu, X. (2021). Low temperature pure boron layer deposition for silicon diode and micromachining applications. [PhD Thesis - Research UT, graduation UT, University of Twente]. University of Twente. https://doi.org/10.3990/1.9789036552547

Nanver, L. K., Qi, L. , Liu, X., & Knežević, T. (2021). Nanolayer boron-semiconductor interfaces and their device applications. Solid-state electronics, 186, [108041]. https://doi.org/10.1016/j.sse.2021.108041

Thammaiah, S. D. , Liu, X., Knežević, T. , Batenburg, K. M. , Aarnink, A. A. I. , & Nanver, L. K. (2021). PureB diode fabrication using physical or chemical vapor deposition methods for increased back-end-of-line accessibility. Solid-state electronics, 177, [107938]. https://doi.org/10.1016/j.sse.2020.107938

Apaydin, R. O. , Onnink, A. J. , Liu, X. , Aarnink, A. A. I. , de Jong, M. P. , Gravesteijn, D. J. , & Kovalgin, A. Y. (2020). Comparative study of thermal and radical-enhanced methods for growing boron nitride films from diborane and ammonia. Journal of vacuum science and technology A: vacuum, surfaces, and films, 38(3), [033411]. https://doi.org/10.1116/6.0000132

Krakers, M., Knezevic, T. , Batenburg, K. M. , Liu, X. , & Nanver, L. K. (2020). Diode design for studying material defect distributions with avalanche-mode light emission. In 2020 IEEE 33rd International Conference on Microelectronic Test Structures, ICMTS 2020 - Proceedings [9107933] (IEEE International Conference on Microelectronic Test Structures; Vol. 2020). IEEE. https://doi.org/10.1109/ICMTS48187.2020.9107933

Knežević, T., Suligoj, T. , Liu, X. , Nanver, L. K., Elsayed, A., Dick, J. F., & Schulze, J. (2019). Back-end-of-line CMOS-compatible diode fabrication with pure boron deposition down to 50 °C. In ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (pp. 242-245). [8901810] (European Solid-State Device Research Conference; Vol. 2019-September). IEEE. https://doi.org/10.1109/ESSDERC.2019.8901810

Liu, X., Italiano, J., Scott, R. , & Nanver, L. K. (2019). Silicon micromachining with nanometer-thin boron masking and membrane material. Materials Research Express, 6(11), [116438]. https://doi.org/10.1088/2053-1591/ab4b03

Knezevic, T. , Liu, X. , Hardeveld, E., Suligoj, T. , & Nanver, L. K. (2019). Limits on Thinning of Boron Layers With/Without Metal Contacting in PureB Si (Photo)Diodes. IEEE electron device letters, 40(6), 858-861. [8686173]. https://doi.org/10.1109/LED.2019.2910465

Nanver, L. K. , Liu, X., & Knezevic, T. (2018). Test structures without metal contacts for DC measurement of 2D-materials deposited on silicon. In ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures (pp. 69-74). (IEEE International Conference on Microelectronic Test Structures; Vol. 2018-March). IEEE. https://doi.org/10.1109/ICMTS.2018.8383767