Carré

A. Shafikov (Airat)

Onderzoeker
TNW-NEM-XUV
Carré C2031
a.shafikov@utwente.nl
+31534897511
Visitekaartje

Expertises

  • Material Science

    • Thin Films
    • Silicon Nitride
    • Transmission Electron Microscopy
    • Membrane
    • Fracture Toughness
    • Metal

  • Physics

    • Blood Plasma
    • Emissivity

Organisaties

Publicaties

2025

Characterization of Plasma-Induced Atomic Diffusion in Thin Films (2025)[Contribution to conference › Poster] International conference on X-Ray and Neutron Multilayer Structures, PXRNMS 2025. Gerlach, L., Shafikov, A., Tsvetanova, M., Sturm, J. M. & Ackermann, M.Characterization of Plasma-Induced Atomic Diffusion in Thin Films (2025)[Contribution to conference › Poster] 1st NNV Plasma Physics Symposium Rolduc. Gerlach, L., Shafikov, A., Tsvetanova, M., Sturm, J. M. & Ackermann, M.TEM observations of plasma - thin film interaction (2025)[Contribution to conference › Poster] NWO Physics 2025. Gerlach, L., Shafikov, A., Tsvetanova, M., Sturm, J. M. & Ackermann, M.

2024

TEM observations of plasma - thin film interaction (2024)[Contribution to conference › Poster] ASML PhD and Postdoc networking event 2024. Gerlach, L., Shafikov, A., Sturm, J. M. & Ackermann, M.TEM observations of plasma - thin film interaction (2024)[Contribution to conference › Poster] MESA+ Day 2024. Gerlach, L., Shafikov, A., Sturm, J. M. & Ackermann, M.

2022

Fracture behavior and characterization of free-standing metal silicide thin films (2022)[Thesis › PhD Thesis - Research UT, graduation UT]. University of Twente. Shafikov, A.https://doi.org/10.3990/1.9789036554251Relation between composition and fracture strength in off-stoichiometric metal silicide free-standing membranes (2022)Intermetallics, 144. Article 107531. Shafikov, A., van de Kruijs, R. W. E., Benschop, J. P. H., Schurink, B., van den Beld, W. T. E., Houweling, Z. S., Kooi, B. J., Ahmadi, M., de Graaf, S. & Bijkerk, F.https://doi.org/10.1016/j.intermet.2022.107531Fracture Toughness of Free-Standing ZrSiₓ Thin Films Measured Using Crack-on-a-Chip Method (2022)Journal of microelectromechanical systems, 31(1), 63-73. Shafikov, A., van de Kruijs, R. W. E., Benschop, J. P. H., van den Beld, W., Houweling, S. & Bijkerk, F.https://doi.org/10.1109/JMEMS.2021.3128760

2021

Strengthening ultrathin Si3N4 membranes by compressive surface stress (2021)Sensors and Actuators A: Physical, 317. Article 112456. Shafikov, A., Schurink, B., van de Kruijs, R. W. E., Benschop, J. P. H., van den Beld, W., Houweling, S. & Bijkerk, F.https://doi.org/10.1016/j.sna.2020.112456

2020

Pellicle for EUV lithograpy (2020)[Patent › Patent]. Shafikov, A., Bijkerk, F., Schurink, B., Sturm, M. & van de Kruijs, R. W. E.

Onderzoeksprofielen

Scan de QR-code of
Download vCard