Expertises

  • Engineering

    • Side Wall
    • Microfluidic Channel
    • Surfaces
    • Applications
    • Sensor
    • Silicon
    • Fabrication Method
  • Physics

    • Fabrication

Organisaties

Publicaties

Jump to: 2026 | 2025 | 2024 | 2023 | 2022 | 2021

2026

Self-Aligned Sidewall Heaters Applied in a Microfluidic Thermal Flow Sensor (2026)In 2026 IEEE 39th International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 139-142). Article 11419397. IEEE Advancing Technology for Humanity. Bonnema, M. J. S., Džemaili, N., Veltkamp, H.-W., Groenesteijn, J., Wiegerink, R. J. & Lötters, J. C.https://doi.org/10.1109/MEMS64181.2026.11419397

2025

A Silicon-Based Combined Hot-Element and Calorimetric Anemometer (2025)IEEE sensors journal, 25(13), 23645-23652. Hackett, T. L., Veltkamp, H.-W., Sanders, R. G. P., van den Berg, T. E., Alveringh, D. & Schmitz, J.https://doi.org/10.1109/JSEN.2025.3570456

2024

Flow-through Microfluidic Relative Permittivity Sensor Using Highly-Doped Silicon Sidewall Electrodes (2024)Journal of micromechanics and microengineering, 34(11). Article 115002. Bonnema, M. J. S., Veltkamp, H.-W., Alveringh, D., Wiegerink, R. J. & Lötters, J. C.https://doi.org/10.1088/1361-6439/ad7ec6Fabrication of Buried Microchannels with Almost Circular Cross-Section Using HNA Wet Etching (2024)Micromachines, 15(10). Article 1230. Yu, Q., Veltkamp, H.-W., Wiegerink, R. J. & Lötters, J. C.https://doi.org/10.3390/mi15101230Next-Generation ATR-IR Devices for Monitoring Chemical Processes (2024)In Next-Generation ATR-IR Devices for Monitoring Chemical Processes. Srivastava, K., Ramaswami, B., Veltkamp, H.-W., Boyle, N., Flaman, G., Bomer, J. G., van den Berg, A., van der Stam, W., Burgess, I. & Odijk, M.Inline and Real-Time Microfluidic Relative Permittivity Sensor Using Highly Doped Silicon Sidewall Electrodes (2024)In 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 805-808). Bonnema, M. J. S., Veltkamp, H.-W., Alveringh, D., Wiegerink, R. J. & Lötters, J. C.https://doi.org/10.1109/mems58180.2024.10439445Microfabrication Technology for Isolated Silicon Sidewall Electrodes and Heaters (2024)In The 5th Conference on MicroFluidic Handling Systems (pp. 53-56). Bonnema, M. J. S., Veltkamp, H.-W., Wiegerink, R. J. & Lötters, J. C.A Method for Comparing Dry Etch Equipment (2024)In 2024 16th International Symposium on Electronics and Telecommunications, ISETC 2024 - Conference Proceedings. IEEE. Avram, A., Veltkamp, H. W., Elias, M., Ronchin, S., De Boer, C., Hovik, J. & De Boer, M.https://doi.org/10.1109/ISETC63109.2024.10797425WIRE SUSPENDED ON A V-GROOVE CAVITY TO MEASURE GAS PHYSICAL PROPERTIES (2024)[Book/Report › Report]. Azadi Kenari, S., Wiegerink, R. J., Batenburg, K. M., Veltkamp, H.-W., Sanders, R. G. P. & Lotterman, H.https://heidelberg-instruments.com/wp-content/uploads/2024/05/Heidelberg-Instruments-Application-Note_Suspended-Wires-V1.3.pdf

2023

Thermal Flow Meter with Integrated Thermal Conductivity Sensor (2023)Micromachines, 14(7). Article 1280. Azadi Kenari, S., Wiegerink, R. J., Veltkamp, H.-W., Sanders, R. G. P. & Lötters, J. C.https://doi.org/10.3390/mi14071280

2022

A miniature microclimate thermal flow sensor for horticultural applications (2022)In 2022 IEEE Sensors. Article 9967348. IEEE. Alveringh, D., Bijsterveld, D. G., Berg, T. E. v. d., Veltkamp, H.-W., Batenburg, K. M., Sanders, R. G. P., Lötters, J. C. & Wiegerink, R. J.https://doi.org/10.1109/SENSORS52175.2022.9967348Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD (2022)Micromachines, 13(11). Article 1908. Veltkamp, H.-W., Janssens, Y. L., de Boer, M. J., Zhao, Y., Wiegerink, R. J., Tas, N. R. & Lötters, J. C.https://doi.org/10.3390/mi13111908Miniature robust high-bandwidth force sensor with mechanically amplified piezoresistive readout (2022)In 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) (pp. 684-687). IEEE. Alveringh, D., van der Ven, D. L., Veltkamp, H.-W., Batenburg, K. M., Sanders, R. G. P., Fernandez Rivas, D. & Wiegerink, R. J.https://doi.org/10.1109/MEMS51670.2022.9699639

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