Carré

prof.dr. J. Schmitz (Jurriaan)

Hoogleraar
EEMCS-EE-IDS
Carré C2617
j.schmitz@utwente.nl
+31534895767
Visitekaartje

Expertises

  • Material Science

    • Temperature
    • Devices
    • Tungsten
    • Metal
    • Electrical Resistivity

  • Physics

    • Electric Potential
    • Silicon
    • Wafer

Organisaties

Publicaties

2024
A Machine Learning Enhanced MEMS Thermal Anemometer for Detection of Flow, Angle of Attack, and Relative HumidityIn A Machine Learning Enhanced MEMS Thermal Anemometer for Detection of Flow, Angle of Attack, and Relative Humidity, Article 6008304 (pp. 1-4). IEEE. Hackett, T., Sanders, R. G. P., Schmitz, J., Alveringh, D., van den Berg, T. E. & Choi, J. Y.https://doi.org/10.1109/LSENS.2024.3418193Viewing stomata in action: Autonomous in planta imaging of individual stomatal movement links morphology and kinetics. bioRxiv. Berg, T. E. v. d., Sanders, R. G. P., Kaiser, E. & Schmitz, J.https://doi.org/10.1101/2024.03.13.584774A Multi-Parameter Measurement System for MEMS Anemoters for Data Collection with Machine Learning Outcomes, 126-129. Hackett, T., Alveringh, D., Sanders, R. G. P., van den Berg, T. E. & Schmitz, J.
2023
Fluid classification with integrated flow and pressure sensors using machine learning, Article 114762. Alveringh, D., Le, D. V., Groenesteijn, J., Schmitz, J. & Lötters, J. C.https://doi.org/10.1016/j.sna.2023.114762Characterisation of Photodiodes in 22 nm FDSOI at 850 nmIn ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) (pp. 65-68). IEEE. Bakker, J. H. T., Oude Alink, M. S., Schmitz, J. & Nauta, B.https://doi.org/10.1109/ESSDERC59256.2023.10268483Thermal Resistivity of FFF Printed Carbon Black Doped PolymersIn 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). IEEE. Jonkers, H., Kosmas, D., Schmitz, J. & Krijnen, G.https://doi.org/10.1109/FLEPS57599.2023.10220388In-depth analysis of potential-induced degradation in a commercial CIGS PV module. Yilmaz, P., de Wild, J., Aninat, R., Weber, T., Vermang, B., Schmitz, J. & Theelen, M.https://doi.org/10.1002/pip.3670Corrigendum to “Inaccuracies in contact resistivity from the Cox–Strack method: A review” [Sol. Energy Mater. Sol. Cells 246 (2022) 111909], Article 112254. van Wijngaarden, B., Yang, J. & Schmitz, J.https://doi.org/10.1016/j.solmat.2023.112254The world of chips: How do you make chips? . Ackermann, M., Nauta, B. & Schmitz, J.https://www.utwente.nl/nl/sg/programma/2023/3/386762/de-wereld-van-chips?code=4abdccddPerformance and Degradation in Silicon PV Systems Under Outdoor Conditions in Relation to Reliability Aspects of Silicon PV Modules - Summary of Results of COST Action PEARL PVIn 2023 IEEE 50th Photovoltaic Specialists Conference, PVSC 2023. IEEE. Lindig, S., Ascencio-Vásquez, J., Leloux, J., Moser, D., Aghaei, M., Fairbrother, A., Gok, A., Ahmad, S., Kazim, S., Lobato, K., Van Sark, W. J. G. H. M., Pearsall, N., Burduhos, B. G., Raghoebarsing, A., Oreski, G., Schmitz, J., Theelen, M., Yilmaz, P., Kettle, J. & Reinders, A. H. M. E.https://doi.org/10.1109/PVSC48320.2023.10359742
2022
Review of technology specific degradation in crystalline silicon, cadmium telluride, copper indium gallium selenide, dye sensitised, organic and perovskite solar cells in photovoltaic modules: Understanding how reliability improvements in mature technologies can enhance emerging technologies, 1365-1392. Kettle, J., Aghaei, m., Ahmad, S., Fairbrother, A., Irvine, S., Jacobsson, J., Kazim, S., Kazukauskas, V., Lamb, D., Lobato, K., Mousdis, G. E. O. R. G. I. O. S., Oreski, G., Reinders, A., Schmitz, J., Yilmaz, P. & Theelen, M.https://doi.org/10.1002/pip.3577Inaccuracies in contact resistivity from the Cox–Strack method: A review, Article 111909, 1-8. van Wijngaarden, B., Yang, J. & Schmitz, J.https://doi.org/10.1016/j.solmat.2022.111909Post-mortem analysis of a commercial Copper Indium Gallium Diselenide (CIGS) photovoltaic module after potential induced degradation, 640-647. Yilmaz, P., Aninat, R., Cruz, G. O., Weber, T., Schmitz, J. & Theelen, M.https://doi.org/10.1002/pip.3538Review of degradation and failure phenomena in photovoltaic modules, Article 112160. Aghaei, M., Fairbrother, A., Gok, A., Kazim, S., Lobato, K., Oreski, G., Reinders, A., Schmitz, J., Theelen, M., Yilmaz, P. & Kettle, J.https://doi.org/10.1016/j.rser.2022.112160Potential induced degradation of CIGS PV systems: A literature review, Article 111819. Yilmaz, P., Schmitz, J. & Theelen, M.https://doi.org/10.1016/j.rser.2021.111819Recovery of hot-carrier degraded nMOSFETs. University of Twente. de Jong, M. J.https://doi.org/10.3990/1.9789036553438
2021
Low temperature pure boron layer deposition for silicon diode and micromachining applications. University of Twente. Liu, X.https://doi.org/10.3990/1.9789036552547Interface States Characterization of UTB SOI MOSFETs From the Subthreshold Current, Article 9305941, 497-502. Vermeer, M. L., Hueting, R. J. E., Pirro, L., Hoentschel, J. & Schmitz, J.https://doi.org/10.1109/TED.2020.3043223
2020
Effect of Ambient on the Recovery of Hot-Carrier Degraded DevicesIn 2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Proceedings, Article 9129540. IEEE. De Jong, M. J., Salm, C. & Schmitz, J.https://doi.org/10.1109/IRPS45951.2020.9129540Analysis of short-circuit transients in the LHC main dipole circuit, Article 012077. Liakopoulou, A., Annema, A. J., Bortot, L., Charifoulline, Z., MacIejewski, M., Prioli, M., Ravaioli, E., Salm, C., Schmitz, J. & Verweij, A. P.https://doi.org/10.1088/1742-6596/1559/1/012077Towards electrostatic doping approaches in ultra-thin body semiconductor materials and devices. University of Twente. Gupta, G.https://doi.org/10.3990/1.9789036550185Conduction and electric field effect in ultra-thin tungsten films, Article 9016070, 202-209. van der Zouw, K., Aarnink, A. A. I., Schmitz, J. & Kovalgin, A. Y.https://doi.org/10.1109/TSM.2020.2976886Anomalous Scaling of Parasitic Capacitance in FETs with a High-K Channel MaterialIn 2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS), Article 9107901. IEEE. Smink, A. E. M., de Jong, M. J., Hilgenkamp, H., Van Der Wiel, W. G. & Schmitz, J.https://doi.org/10.1109/ICMTS48187.2020.9107901On the Accuracy of the Cox-Strack Equation and Method for Contact Resistivity Determination, Article 9031713, 1757-1763. van Rijnbach, M., Hueting, R. J. E., Stodolny, M., Janssen, G., Melskens, J. & Schmitz, J.https://doi.org/10.1109/TED.2020.2974194RFID Tag Failure after Thermal OverstressIn 2019 IEEE International Integrated Reliability Workshop, IIRW 2019, Article 8989885. IEEE. Ozturk, E., Dikkers, M. J., Batenburg, K. M., Salm, C. & Schmitz, J.https://doi.org/10.1109/IIRW47491.2019.8989885

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