ir. M. Krakers (Max)

Nanver, L. K., Knežević, T. , Liu, X. , D. Thammaiah, S. , & Krakers, M. (2021). On the Many Applications of Nanometer-Thin Pure Boron Layers in IC and Microelectromechanical Systems Technology. Journal of nanoscience and nanotechnology, 21(4), 2472-2482. https://doi.org/10.1166/jnn.2021.19112

Krakers, M., Knežević, T. , & Nanver, L. K. (2021). Optoelectrical Operation Stability of Broadband PureGaB Ge-on-Si Photodiodes with Anomalous Al-Mediated Sidewall Contacting. Journal of electronic materials, 50(12), 7026-7036. https://doi.org/10.1007/s11664-021-09233-8

Lozeman, J. J. A., Elsbecker, T., Bohnenn, S. , de Boer, H. L. , Krakers, M. , Mul, G. , van den Berg, A. , & Odijk, M. (2020). Modular microreactor with integrated reflection element for online reaction monitoring using infrared spectroscopy. Lab on a chip, 20(22), 4166-4174. https://doi.org/10.1039/d0lc00704h

Krakers, M., Knezevic, T. , Batenburg, K. M. , Liu, X. , & Nanver, L. K. (2020). Diode design for studying material defect distributions with avalanche-mode light emission. In 2020 IEEE 33rd International Conference on Microelectronic Test Structures, ICMTS 2020 - Proceedings Article 9107933 (IEEE International Conference on Microelectronic Test Structures; Vol. 2020). IEEE. https://doi.org/10.1109/ICMTS48187.2020.9107933

Knezević, T. , Krakers, M. , & Nanver, L. K. (2020). Broadband PureGaB Ge-on-Si photodiodes responsive in the ultraviolet to near-infrared range. In S. Jiang, & M. J. F. Digonnet (Eds.), Optical Components and Materials XVII Article 112760I (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11276). SPIE. https://doi.org/10.1117/12.2546734

Krakers, M., Kneževic, T. , & Nanver, L. K. (2019). Reverse breakdown and light-emission patterns studied in Si PureB SPADs. In K. Skala, Z. Car, P. Pale, D. Huljenic, M. Janjic, M. Koricic, V. Sruk, S. Ribaric, T. G. Grbac, Z. Butkovic, M. Cicin-Sain, D. Skvorc, M. Mauher, S. Babic, S. Gros, B. Vrdoljak, & E. Tijan (Eds.), 2019 42nd International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2019 - Proceedings (pp. 30-35). Article 8757007 IEEE. https://doi.org/10.23919/MIPRO.2019.8757007