Expertises
Material Science
- Devices
- Silicon
- Diode
- Transistor
Physics
- Avalanche
- Electric Potential
- Insulators
Engineering
- Light-Emitting Diode
Organisaties
Publicaties
2025
Electrical and 850 nm Optical Characterisation of Back-Gate Controlled 22 nm FDSOI PIN-Diodes Without Front-Gate (2025)Journal of the Electron Devices Society (E-pub ahead of print/First online). Bakker, J. H. T., Motycki, M. Ł., Hueting, R. J. E., Annema, A.-J. & Oude Alink, M. S.https://doi.org/10.1109/JEDS.2025.3537290A New Silicon Accumulation-Mode Trench Bidirectional Switch (2025)IEEE Transactions on Electron Devices. Abnavi, H., Steenge, C., Berenschot, J. W., Tas, N. R. & Hueting, R. J. E.https://doi.org/10.1109/TED.2025.3546582
2024
Vertical silicon nanowedge formation by repetitive dry and wet anisotropic etching combined with 3D self-aligned sidewall nanopatterning (2024)Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. Pordeli, Y., Steenge, C., Berenschot, E. J. W., Hueting, R. J. E., Migliorini, A., Parkin, S. S. P. & Tas, N. R.https://doi.org/10.1116/6.0004024Vertical silicon nanowedge formation by repetitive dry and wet anisotropic etching combined with 3D self-aligned sidewall nanopatterning (2024)Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics, 42(6). Article 062805. Pordeli, Y., Steenge, C., Berenschot, E. J. W., Hueting, R. J. E., Migliorini, A., Parkin, S. S. P. & Tas, N. R.https://doi.org/10.1116/6.0004024Advanced packaging for SiC power modules (2024)[Thesis › PhD Thesis - Research external, graduation UT]. University of Twente. Wang, L.https://doi.org/10.3990/1.9789036561730Ruggedness of Silicon Power MOSFETs–Part II: Device Design Failures and Modeling: A Review (2024)IEEE Transactions on Electron Devices, 71(6), 3458-3469. Tambone, R., Ferrara, A., Siemieniec, R., Wood, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2024.3394463Ruggedness of Silicon Power MOSFETs—Part I: Cell Structure Design Related Failure: A Review (2024)IEEE Transactions on Electron Devices, 71(6), 3445-3457. Tambone, R., Ferrara, A., Siemieniec, R., Wood, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2024.3394452Development of Pressure Contact Technology for Multi-chip SiC Modules with Low Parasitics (2024)In 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 202-209) (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). IEEE. Wang, L., Wang, W., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/APEC48139.2024.10509116Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules (2024)IEEE transactions on power electronics, 39(2), 2401-2419. Wang, L., Wang, W., Zeng, K., Deng, J., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/TPEL.2023.3332050A Systematic Comparison Study of Different Bonding Technologies for Large Substrate Attachment of Power Electronics (2024)In International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2024 (pp. 2055-2061) (PCIM Europe Conference Proceedings; Vol. 2024-June). VDE Verlag. Wang, L., Rietveld, G. & Hueting, R. J. E.
Onderzoeksprofielen
Verbonden aan opleidingen
Vakken collegejaar 2024/2025
Vakken in het huidig collegejaar worden toegevoegd op het moment dat zij definitief zijn in het Osiris systeem. Daarom kan het zijn dat de lijst nog niet compleet is voor het gehele collegejaar.
- 191211000 - Semiconductor Project
- 191211208 - Internship EE
- 191211219 - Master Thesis Project
- 191211650 - Multi-Disciplinary Design Project
- 201600187 - Individual Project
- 201900135 - Advanced Semiconductor Device Physics
- 201900223 - Capita Selecta Electrical Engineering
- 202000637 - Semiconductor Devices
- 202001145 - Semiconductor Physics
- 202001146 - Semiconductor Devices
- 202001148 - Optical Devices
- 202001149 - Project M7A
- 202001162 - Bachelor Thesis EE
- 202001434 - Internship EMSYS
- 202200388 - Capita Selecta Power Electronics
- 202300070 - Final Project EMSYS
Vakken collegejaar 2023/2024
- 191211000 - Semiconductor Project
- 191211208 - Internship EE
- 191211219 - Master Thesis Project
- 191211650 - Multi-Disciplinary Design Project
- 201600017 - Final Project Preparation
- 201600187 - Individual Project
- 201900135 - Advanced Semiconductor Device Physics
- 201900200 - Final Project EMSYS
- 201900223 - Capita Selecta Electrical Engineering
- 202000637 - Semiconductor Devices
- 202001145 - Semiconductor Physics
- 202001146 - Semiconductor Devices
- 202001148 - Optical Devices
- 202001149 - Project M7A
- 202001162 - Bachelor Thesis EE
- 202001434 - Internship EMSYS
- 202200388 - Capita Selecta Power Electronics
- 202300070 - Final Project EMSYS
Adres

Universiteit Twente
Carré (gebouwnr. 15), kamer C2613
Hallenweg 23
7522 NH Enschede
Universiteit Twente
Carré C2613
Postbus 217
7500 AE Enschede