Carré

dr.ir. R.J.E. Hueting (Ray)

Universitair hoofddocent
EEMCS-EE-PE
Carré C2613
r.j.e.hueting@utwente.nl
+31534892754
Visitekaartje

Expertises

  • Material Science

    • Devices
    • Diode
    • Transistor

  • Physics

    • Silicon
    • Avalanche
    • Electric Potential
    • Insulators

  • Engineering

    • Light-Emitting Diode

Organisaties

Publicaties

2024

Vertical silicon nanowedge formation by repetitive dry and wet anisotropic etching combined with 3D self-aligned sidewall nanopatterning (2024)Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics, 42(6). Article 062805. Pordeli, Y., Steenge, C., Berenschot, E. J. W., Hueting, R. J. E., Migliorini, A., Parkin, S. S. P. & Tas, N. R.https://doi.org/10.1116/6.0004024Advanced packaging for SiC power modules (2024)[Thesis › PhD Thesis - Research external, graduation UT]. University of Twente. Wang, L.https://doi.org/10.3990/1.9789036561730Ruggedness of Silicon Power MOSFETs–Part II: Device Design Failures and Modeling: A Review (2024)IEEE Transactions on Electron Devices, 71(6), 3458-3469. Tambone, R., Ferrara, A., Siemieniec, R., Wood, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2024.3394463Ruggedness of Silicon Power MOSFETs—Part I: Cell Structure Design Related Failure: A Review (2024)IEEE Transactions on Electron Devices, 71(6), 3445-3457. Tambone, R., Ferrara, A., Siemieniec, R., Wood, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2024.3394452Development of Pressure Contact Technology for Multi-chip SiC Modules with Low Parasitics (2024)In 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 202-209) (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). IEEE. Wang, L., Wang, W., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/APEC48139.2024.10509116Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules (2024)IEEE transactions on power electronics, 39(2), 2401-2419. Wang, L., Wang, W., Zeng, K., Deng, J., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/TPEL.2023.3332050A Systematic Comparison Study of Different Bonding Technologies for Large Substrate Attachment of Power Electronics (2024)In International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2024 (pp. 2055-2061) (PCIM Europe Conference Proceedings; Vol. 2024-June). VDE Verlag. Wang, L., Rietveld, G. & Hueting, R. J. E.

2023

A new SiC power module assembly based on silver sintering bonding (2023)In 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. IEEE. Wang, L., Lei, Z., Liang, R., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264386Reconfigurable Double Pulse Test Setup for Si and Wide Bandgap Power FETs (2023)In PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Alimawi, M., Koch, P., Venugopal, P. & Hueting, R.https://doi.org/10.30420/566091165Distributed field plate effects in split-gate trench MOSFETs (2023)In 2023 35th International Conference on Microelectronic Test Structure, ICMTS 2023 (IEEE International Conference on Microelectronic Test Structures; Vol. 2023-March). IEEE. Tambone, R., Ferrara, A., Magrini, F., Hoffmann, A., Wood, A., Noebauer, G., Gondro, E. & Hueting, R. J. E.https://doi.org/10.1109/ICMTS55420.2023.10094167

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