Carré

dr.ir. R.J.E. Hueting (Ray)

Universitair hoofddocent
EEMCS-EE-PE
Carré C2613
r.j.e.hueting@utwente.nl
+31534892754
Visitekaartje

Expertises

  • Material Science

    • Devices
    • Silicon
    • Transistor
    • Diode

  • Physics

    • Avalanche
    • Electric Potential
    • Insulators

  • Engineering

    • Light-Emitting Diode

Organisaties

Publicaties

2025

A Double-Sided Cooling SiC Power Module with Pressure Contact Packaging (2025)IEEE Journal of Emerging and Selected Topics in Power Electronics, 13(5), 5713-5722. Article 0b000064941030c9. Wang, L., Wang, W., Zeng, K., Zhang, R., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/JESTPE.2025.3580428Impact of Defects on the Low-Field Electron Mobility in GaN-on-Si HEMTs (2025)Journal of the Electron Devices Society, 13, 516-523. Zhou, R., Gravesteijn, D. J. & Hueting, R. J. E.https://doi.org/10.1109/JEDS.2025.3577260Thermal Shock Reliability of Silver-Sintered Bonding of Metal-Plated Aluminum Surfaces (2025)IEEE transactions on device and materials reliability, 25(2), 203-211. Wang, L., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/TDMR.2025.3554369Behavior of Split-Gate Trench MOSFETs in Critical Conditions Caused by Distributed Effects (2025)IEEE Transactions on Electron Devices, 72(6), 3068-3075. Tambone, R., Ferrara, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2025.3564257Design and Fabrication of a Ceramic Substrate-Embedded SiC Power Module (2025)IEEE Transactions on Components, Packaging and Manufacturing Technology, 15(5), 938-948. Wang, L., Deng, J., Zeng, K., Cheng, H., Wu, Q., Lin, J., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/TCPMT.2025.3538658Impact of the collector structure on the performance of the insulated gate bipolar transistor (2025)Microelectronics, 159. Article 106651. van Zoeren, J., Gupta, G., Boksteen, B., Nanver, L. K. & Hueting, R. J. E.https://doi.org/10.1016/j.mejo.2025.106651A New Silicon Accumulation-Mode Trench Bidirectional Switch (2025)IEEE Transactions on Electron Devices, 72(4), 1900-1906. Abnavi, H., Steenge, C., Berenschot, J. W., Tas, N. R. & Hueting, R. J. E.https://doi.org/10.1109/TED.2025.3546582Thermo-mechanical Design of Heterogeneous Integrated Wide Bandgap Power Modules (2025)[Thesis › PhD Thesis - Research UT, graduation UT]. University of Twente. Wang, L.https://doi.org/10.3990/1.9789036565127Electrical and 850 nm Optical Characterization of Back-Gate Controlled 22 nm FDSOI PIN-Diodes Without Front-Gate (2025)Journal of the Electron Devices Society, 13, 190-199. Bakker, J. H. T., Motycki, M. Ł., Hueting, R. J. E., Annema, A.-J. & Oude Alink, M.https://doi.org/10.1109/JEDS.2025.3537290

2024

Vertical silicon nanowedge formation by repetitive dry and wet anisotropic etching combined with 3D self-aligned sidewall nanopatterning (2024)Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics, 42(6). Article 062805. Pordeli, Y., Steenge, C., Berenschot, E. J. W., Hueting, R. J. E., Migliorini, A., Parkin, S. S. P. & Tas, N. R.https://doi.org/10.1116/6.0004024

Onderzoeksprofielen

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