Carré

dr.ir. R.J.E. Hueting (Ray)

Universitair hoofddocent
EEMCS-EE-PE
Carré C2613
r.j.e.hueting@utwente.nl
+31534892754
Visitekaartje

Expertises

  • Material Science

    • Devices
    • Diode
    • Transistor

  • Physics

    • Silicon
    • Avalanche
    • Electric Potential
    • Insulators

  • Engineering

    • Light-Emitting Diode

Organisaties

Publicaties

2024
Advanced packaging for SiC power modules. University of Twente. Wang, L.https://doi.org/10.3990/1.9789036561730Ruggedness of Silicon Power MOSFETs–Part II: Device Design Failures and Modeling: A Review. Tambone, R., Ferrara, A., Siemieniec, R., Wood, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2024.3394463Development of Pressure Contact Technology for Multi-chip SiC Modules with Low ParasiticsIn 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 202-209). IEEE. Wang, L., Wang, W., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/APEC48139.2024.10509116Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules. Wang, L., Wang, W., Zeng, K., Deng, J., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.1109/TPEL.2023.3332050Ruggedness of Silicon Power MOSFETs—Part I: Cell Structure Design Related Failure: A Review. Tambone, R., Ferrara, A., Siemieniec, R., Wood, A., Magrini, F. & Hueting, R. J. E.https://doi.org/10.1109/TED.2024.3394452
2023
Reconfigurable Double Pulse Test Setup for Si and Wide Bandgap Power FETsIn PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Alimawi, M., Koch, P., Venugopal, P. & Hueting, R.https://doi.org/10.30420/566091165Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging, 472-490. Wang, L., Wang, W., Hueting, R. J. E., Rietveld, G. & Ferreira, J. A.https://doi.org/10.1109/TPEL.2022.3200469A new SiC power module assembly based on silver sintering bondingIn 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. IEEE. Wang, L., Lei, Z., Liang, R., Rietveld, G. & Hueting, R. J. E.https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264386Distributed field plate effects in split-gate trench MOSFETsIn 2023 35th International Conference on Microelectronic Test Structure, ICMTS 2023. IEEE. Tambone, R., Ferrara, A., Magrini, F., Hoffmann, A., Wood, A., Noebauer, G., Gondro, E. & Hueting, R. J. E.https://doi.org/10.1109/ICMTS55420.2023.10094167
2022
Multi-Physical Design of a Wave Spring Connector for a Highly-Reliable GaN Power ModuleIn 2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC), Article 9959435 (pp. 290-295). IEEE. Wang, L., Wang, W., J.e., H. R. & Rietveld, G.https://doi.org/10.1109/PEAC56338.2022.9959435

Onderzoeksprofielen

Verbonden aan opleidingen

Vakken collegejaar 2023/2024

Vakken in het huidig collegejaar worden toegevoegd op het moment dat zij definitief zijn in het Osiris systeem. Daarom kan het zijn dat de lijst nog niet compleet is voor het gehele collegejaar.

Vakken collegejaar 2022/2023

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