Expertises
Engineering
- High Aspect Ratio
- Lithography
- Silicon
- Demonstrates
- Dimensional Control
- High Density
- Machining
- Silicon Wafer
Organisaties
Publicaties
2020
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography (2020)Microsystems & nanoengineering, 6(1). Article 25. Ni, S., Berenschot, E. J. W., Westerik, P. J., de Boer, M. J., Wolf, R., Le-The, H., Gardeniers, H. J. G. E. & Tas, N. R.https://doi.org/10.1038/s41378-020-0134-6
Onderzoeksprofielen
Adres
Universiteit Twente
Nanolab (gebouwnr. 16), kamer 1011
Hallenweg 23
7522 NH Enschede
Universiteit Twente
Nanolab 1011
Postbus 217
7500 AE Enschede
Scan de QR-code of