Expertises
Engineering
- High Aspect Ratio
- Lithography
- Silicon
- Demonstrates
- Dimensional Control
- High Density
- Machining
- Silicon Wafer
Organisaties
Publicaties
2020
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography, Article 25. Ni, S., Berenschot, E. J. W., Westerik, P. J., de Boer, M. J., Wolf, R., Le-The, H., Gardeniers, H. J. G. E. & Tas, N. R.https://doi.org/10.1038/s41378-020-0134-6
Onderzoeksprofielen
Adres
![](/.uc/i0140cea90103dae911005ad5f4034556019834cfaee50801e3bc0268018041/nanolab.jpg)
Universiteit Twente
Nanolab (gebouwnr. 16), kamer 1011
Hallenweg 23
7522 NH Enschede
Universiteit Twente
Nanolab 1011
Postbus 217
7500 AE Enschede