dr. S. Ni (Shu)

Ni, S. , Houwman, E. , Koster, G. , & Rijnders, G. (2023). On the importance of the SrTiO₃ template and the electronic contact layer for the integration of phase-pure low hysteretic Pb(Mg_0.33Nb_0.67)O₃-PbTiO₃ layers with Si. Applied physics A: Materials science and processing, 129(4), Article 275. https://doi.org/10.1007/s00339-023-06447-x

Kante, M. V., Weber, M. L. , Ni, S., van den Bosch, I. C. G., van der Minne, E., Heymann, L., Falling, L. J., Gauquelin, N. , Tsvetanova, M. , Cunha, D. M. , Koster, G., Gunkel, F., Nemšák, S., Hahn, H., Velasco Estrada, L. , & Baeumer, C. (2023). A High-Entropy Oxide as High-Activity Electrocatalyst for Water Oxidation. ACS nano, 17(6), 5329-5339. https://doi.org/10.1021/acsnano.2c08096

Le, P. T. P. , Ni, S., Repecaud, P. A., van der Minne, E. , van den Nieuwenhuijzen, K. J. H. , Nguyen, M. D. , ten Elshof, J. E. , Morales-Masis, M. , & Koster, G. (2023). Correlated Metals Transparent Conductors with High UV to Visible Transparency on Amorphous Substrates. Advanced materials interfaces, 10(1), Article 2201335. https://doi.org/10.1002/admi.202201335

van der Minne, E., van den Bosch, I. C. G. , Le, T. P. P., Kiens, E. , Ni, S., Heymann, L. , Koster, G. , & Baeumer, C. (2022). Electrochemical Thin Films and Interfaces. Poster session presented at MESA+ Meeting 2022, Enschede, Netherlands.

Ni, S., Kante, M. V. , M. Cunha, D., Weber, M. L., van den Bosch, I. C. G., Heymann, L., van der Minne, E., Falling, L. , Koster, G., Gunkel, F., Nemsak, S., Hahn, H., Velasco, M. , & Baeumer, C. (2022). High-activity electrocatalyst La(Cr0.2Mn0.2Fe0.2Co0.2Ni0.2)O3 for water oxidation. Poster session presented at NWO CHAINS 2022, Veldhoven, Netherlands.

Ni, S. (2022). Relaxor ferroelectric PMN-PT thin films for low hysteretic microelectronic devices. [PhD Thesis - Research UT, graduation UT, University of Twente]. University of Twente. https://doi.org/10.3990/1.9789036554640

Ni, S. , Berenschot, E. J. W. , Westerik, P. J. , de Boer, M. J. , Wolf, R. , Le-The, H. , Gardeniers, H. J. G. E. , & Tas, N. R. (2020). Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography. Microsystems and Nanoengineering, 6(1), Article 25. https://doi.org/10.1038/s41378-020-0134-6